Wafer bonding of thinned electronic materials and circuits to high performance substrate
NRL
A method of bonding a wafer to a substrate comprising the steps of: providing a wafer having a front surface and a back surface; attaching the front surface of the wafer to a support; thinning the wafer from the back surface; bonding the back surface of the wafer to a substrate using a thin bonding technique; and removing the support from the front surface of the wafer. A circuit comprising: a substrate; and a wafer; wherein the wafer is at most about 50 microns thick; wherein the wafer has a front surface comprising features; and wherein the wafer has a back surface bonded to the substrate using a thin bonding technique.
Inventors:
Kub, Francis; Hobart, Karl
Patent Number:
Technical domain:
Materials and Coatings
FIle Date:
2005-11-22
Grant Date:
2008-04-15
Grant time:
875 days
Grant time percentile rank:
16
Claim count percentile rank:
7
Citations percentile rank:
1
'Cited by' percentile rank:
2
Assignee:
US NAVY
