Laser-based technique for producing and embedding electrochemical cells and electronic components directly into circuit board materials
NRL
A method is provided for embedding electronic components including electrochemical cells within a circuit board substrate. The method includes micromachining the printed circuit board substrate to a selective depth to form a recess. A component is inserted into the recess and an electrical connection is established between the electrical component and a metallized pattern of the circuit board substrate using, e.g., laser direct-write.
Inventors:
Arnold, Craig B.; Pique, Alberto; Auyeung, Ray; Nurnberger, Michael
Patent Number:
Technical domain:
Communications
FIle Date:
2004-06-09
Grant Date:
2006-01-17
Grant time:
587 days
Grant time percentile rank:
10
Claim count percentile rank:
7
Citations percentile rank:
1
'Cited by' percentile rank:
1
Assignee:
US NAVY
